The following manufacturers provide ready-to-use PLECS models for their power semiconductors. The thermal models can be downloaded from the manufacturer's web page.
| Manufacturer | Device Type | Link/Contact |
|---|---|---|
| Dynex | IGBTs, fast recovery diodes | Link |
| Fuji Electric | IGBT modules | Contact info@plexim.com for support. |
| GaN Systems (GaN) | MOSFETs | Link |
| Hitachi Energy (ABB) | IGBT insulated modules | Link |
| IGBT press-pack modules | Link | |
| IGCTs | Link | |
| fast recovery diodes | Link | |
| RoadPak SiC e-mobility modules | Link | |
| Hitachi Power Semiconductors | Various IGBT, SiC modules | Contact info@plexim.com for support. |
| Infineon | Various Power Devices | Link |
| Microchip (Microsemi) | SiC MOSFETs, diodes | Link |
| onsemi | Automotive power modules | Contact info@plexim.com for support. |
| quorvo (UnitedSiC) | SiC MOSFETs | Link (click "Design Files" for a device) |
| SiC Schottky diodes | Link (click "Design Files" for a device) | |
| Rohm Semiconductor | Field stop trench IGBTs | Link |
| SiC power modules | Link | |
| SiC MOSFETs | Link | |
| Wolfspeed (SiC) | MOSFETs, modules, diodes | Link |
In order to use these models, add the folder(s) containing the .xml files to the list of "Thermal description search paths" in the "Thermal" tab of the PLECS Preferences window. Then, click the Rescan button. The models are then available for association to the relevant power semiconductor component types in PLECS.