Thermal Modeling and Simulation
The PLECS Conference is coming back in 2024 with insights into simulating thermal behavior of power semiconductors. The speakers are various users of PLECS from industry, research, and academia. In the exhibition, engineers of semiconductor manufacturers will be ready for discussion. The two-day event will also provide plenty of networking opportunities with all participants. The participation fee will be 700.00 Euros or Swiss Francs (incl. 8.1% VAT).
The conference language will be English. As this is an on-site only event, there will be no virtual replacement. The Plexim staff is excited to welcome you in Zurich, on March 12 and 13, 2024! Please see the agenda and the registration form.
New, extended registration deadline until March 6, 2024.
Impressions of the previous PLECS Conference:
from Infineon, Hitachi Energy, Onsemi, Semikron Danfoss, Fraunhofer IEE, Aalborg University, Politecnico di Torino and more
Please send your completed registration form via email to info@plexim.com or via fax to +41 44 533 51 01.It is recommended to open and complete the form in your web browser.
